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【ERS】Warpage Adjustment

【ERS】Warpage Adjustment

The ERS WAT 330 is a fully automatic tool for the thermal forming of 300/330mm FOWLP wafers.  The specially-designed ERS TriTemp Slide® in this system makes it possible to successfully form a wide variety of FOWLP wafers at various stages in their processing and the resulting wafer shape can be matched to the handling specifications of the downstream tool.

The ERS WAT 330 is able to process up to four FOUPs in a fully-automatic operation.  It is equipped with a Wafer-ID reader and an automatic warpage measurement station that enables a high flexibility with 3 separate operation modes.  It can be used strictly as a warpage measurement station, as a warpage adjustment station, or as a warpage measure/adjust/monitor station.

The upgraded WAT330 comes with a HEPA filter system for cleanroom class 100. It is also fully compliant with the GEM300 SEMI standards and compatible with automated product loading and unloading. Another upgrade is the machine’s Nitrogen environment, which can reach down to 0.5% O2 level to avoid Cu oxidation. The new WAT330 also features strong vacuum thermal chucks for no-fail wafer handling.

 

【Specification】

WAT 规格
Wafer Size
200 mm or 300/330 mm
Handling System
One 4-Axis Robot; special endeffector
Maximum Input Warpage
± 7mm
Warpage Adjust Method
ERS TriTemp Slide
Typical Output Warpage
< 500µm
Temperature Control
DC PID and ERS AirCool® components
Temperature Range
-10°C up to +260°C (depending on station)
Oxygen Free Environment
Optional
W x D x H
2273 x 1134 x 1741 mm
Weight
1800kg

 

【Facility Supply】

设施项目
规格
Voltage
400 VAC 3-phase 32A
Frequency
50 / 60 Hz
Power
18 kW
CDA Pressure
6 bar at 0 °C dew point
CDA Flow Rate
1000 l/min peak
Vacuum Pressure
100 mbar
Vacuum Flow Rate
100 l/min

 

 

ERS electronic GmbH, based in Munich, has been producing innovative thermal test solutions for the semiconductor industry for 50 years. Today, thermal chuck systems developed by ERS in its product families; AC3, AirCool©, AirCool© Plus and PowerSense© are an integral component in all larger-sized wafer probers across the semiconductor industry. ERS also developed eWLB series for warpage adjustment, and has kept making technology progress and improvements over a decade.