The latest version of 3S IN-LINE VACUUM REFLOW OVEN for power device is equipped with features of low void rate, in-line production, automatic flux filtering, high throughput, superb price performance, low nitrogen consumption, high reliability and easy operation.
This vacuum reflow oven will be suitable for power device with high reliability such as automotive industry.
3S is a total solution provider of die bonding in discrete power devices. 3S is established in 1998, headquartered in Hsinchu, with branch offices and sales offices in Shanghai, Singapore, Philippines and Malaysia.
