✔ INSPECTRA® 系列滿足半導體前後段製程高速、高精度的全自動檢測需求！
✔ Toray 獨家 Die-to- Statistical-Image的比較技術可有效降低缺陷檢測過程中造成的損壞及誤判率。
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產品功能
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功能特點
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應用效益
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高解析度的大範圍檢測
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速度快，敏感度高
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良好檢測結果的高生產力
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Die-to-Statistical-Image 演算法
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達成缺陷檢測目標
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控制流程變異及誤宰
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多款光學及硬體系統
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提供光學檢測解決方案
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適用多種晶圓尺寸及晶圓種類
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項目
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規格
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適用晶圓尺寸
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2 ~ 12吋矽晶圓／帶框晶圓／化合物晶圓／玻璃晶圓等
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缺陷檢出尺寸
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> 0.5 μm
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應用範圍
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正面／背面／邊緣
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應用領域
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大規模積體電路(LSI)、影像感測器(CIS)、微機電(MEMS)、LED、凸塊(Bump)、直通矽晶穿孔(TSV)檢測、電源晶片、功率元件(SiC)、氮化鎵(GaN)、化合物半導體
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The corporate philosophy of the Toray Group is contributing to society through the creation of new values.
TASMIT, a member of Toray Engineering Group, executes this corporate philosophy with the aim of becoming a company that is highly valued by all of its stakeholders including customers, shareholders and employees.
To do this, TASMIT will contribute to solving social issues through its business and implement the idea of Creating Shared Value (CSV), which combines social values with corporate values.
TASMIT promises to provide effective solutions for the semiconductor device manufacturing with our two core technologies: optical wafer inspection "Inspectra" and electron wafer pattern inspection "NGR".
