【Southport】3D Stress Inspection & Analysis System for WBG Materials

JadeSA-WBG, Non-contact Whole Wafer / MicroArea 3D Stress Inspection and Analysis System for WBG Materials

Effectively reflect the intrinsic property of WBG materials ‒ stress distribution on surface and in depth
Suitable for monitor the stress distribution and polytype uniformity of SiC substrate, homogeneous and heterogeneous epi wafer, and device process review

【Features】

Advanced 3D Raman inspection technology
Effectively reflect the intrinsic property of WBG materials ‒ stress distribution on surface and in depth
Capable of providing the percentage of unexpected polytype in the wafer
Capable of performing whole wafer scan at specific depth with stress mapping
Capable of performing MicroArea 3D stress mapping
Capable of performing 3D polytype analysis
Suitable for monitor the stress distribution and polytype uniformity of SiC substrate, homogeneous and heterogeneous epi wafer, and device process review
Applied to 2”, 4”, 6”, 8” substrates

【Advantages】

Suitable for inspect and identify unexpected polytype in wafers
Suitable for analyzing the differences of stress distribution between substrates from the same ingot
Suitable for analyzing the stress distribution of substrate and epi layer, and the correlation with major crystal defects
Suitable for epi manufacture to conduct IQC on incoming substrate
Detailed 3D MicroArea stress mapping facilitates defects and process analysis
Suitable for analyzing the effects of process and temperature on the change of defects and crystal morphology

【Benefits】

Help improve the ingot growth process by examining substrates from the same ingot and ingots from different batches or parameters
Help improve the SiC CMP process by examining substrates from the same ingot
Improve epi process performance and achieve heterogeneous integration process optimization
Help establish the causal relationship from material-end to the device-end, further build a deeper know-how and know-why, improve yield, output, performance and component reliability, and effectively reduce the overall cost

【Introduction Video】

【Specifications】

Model Number	SP3055S
Model Name	JadeSA-WBG, non-contact whole wafer / microarea 3D stress inspection and analysis system for SiC substrate, SiC on SiC, GaN on Si, GaN on SiC, GaN substrate
SiC Substrate / EPI Wafer Size	2” 4” 6” 8”
Inspection Items	Whole wafer stress mapping MicroArea stress mapping Polytype detection (4H, 6H, 3C SiC)
Whole Wafer Stress Mapping	Estimated Inspection Time	2 mm Step Size	40 mins / layer (4”) 1.5 hrs / layer (6”)
	Estimated Inspection Time	1 mm Step Size	2 hrs / layer (4”) 4.5 hrs / layer (6”)
	Axial Resolution	1 μm
	Min. Step Size of XY Plane	0.1 mm
	Max. Step Size of XY Plane	5 mm
	XY Stage Repeatability	0.1 μm
	Min Increment of Z Stage	0.02 μm
	Analysis	Whole wafer stress analysis Polytype Detection
MicroArea Stress Mapping	Field of View	250 μm
	Mapping Resolution	Up to 512 x 512
	Lateral Resolution	0.3 μm
	Axial Resolution	1 μm
	Min Increment of Z Stage	0.02 μm
	Analysis	MicroArea stress analysis Polytype detection

Southport Co. was established in August 2014. The founding team gathered talents from cross fields such as optics, materials, physics, and information, introducing novel optical design concepts in optical engineering.Based on the two core technologies of 5D microscopy and digital optics, Southport has introduced brand-new optics concepts and technologies into four key application areas: advanced material analysis, biomedical imaging, microstructure and transparent material inspection, and digital optics. Southport is committed to focusing on solving critical problems for R&D, relieving the pains in practices for facilitating innovation. Through integrating the knowledge of light, mechanics, electronics, and software, incorporated with modular and digital design genes, and further combined with our knowledge and experiences, Southport is ready to provide the cutting-edge optical tools needed by academia and industry.