Model Number
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SP3055S
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Model Name
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JadeSA-WBG, non-contact whole wafer / microarea 3D stress inspection and analysis system for SiC substrate, SiC on SiC, GaN on Si, GaN on SiC, GaN substrate
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SiC Substrate /
EPI Wafer Size
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2” 4” 6” 8”
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Inspection Items
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Whole wafer stress mapping MicroArea stress mapping
Polytype detection (4H, 6H, 3C SiC)
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Whole Wafer
Stress Mapping
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Estimated Inspection Time
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2 mm Step Size
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40 mins / layer (4”)
1.5 hrs / layer (6”)
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1 mm Step Size
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2 hrs / layer (4”)
4.5 hrs / layer (6”)
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Axial Resolution
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1 μm
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Min. Step Size of XY Plane
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0.1 mm
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Max. Step Size of XY Plane
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5 mm
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XY Stage Repeatability
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0.1 μm
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Min Increment of Z Stage
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0.02 μm
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Analysis
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Whole wafer stress analysis
Polytype Detection
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MicroArea
Stress Mapping
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Field of View
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250 μm
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Mapping Resolution
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Up to 512 x 512
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Lateral Resolution
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0.3 μm
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Axial Resolution
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1 μm
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Min Increment of Z Stage
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0.02 μm
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Analysis
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MicroArea stress analysis
Polytype detection
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